VS-UHF-PT-305 T3-T6 - Sn96.5Ag3.0Cu0.5 lead-free halogen-free ultra-low-voiding no-clean pin testable rosin solder paste 3% silver SAC305 (ROL0) F reducing the component's lifespan
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VS-UHF-PT-305 T3-T6 - Sn96.5Ag3.0Cu0.5 lead-free halogen-free ultra-low-voiding no-clean pin testable rosin solder paste 3% silver SAC305 (ROL0) F reducing the component's lifespanVS UHF PT 305 Sn96. 5Ag3. 0Cu0. 5 lead free halogen free ultra low voiding no clean pin testable rosin solder paste 3% silver SAC305 (ROL0) IPC designation: ROL0 (no clean). REACH complaint LGA, BGA, CSP assembly. Halogen free per EN14582 method ZERO Halogen. Ultra Low voiding. Clear residue. Optimal viscosity. Superior dispensing, stencil printing, pin transfer. Sharp definition at high speeds. Universal for most PCB finishes. Long stencil life Easy
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